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    ·Generic-Reliability-Assurance-Requirements-for-Passive-Optical-Components-GR-1221-CORE
    ·Electronic-And-Electrical-Component-Parts-MIL-STD-202-Method106
    ·Test-Methods-For-Semiconductor-Devices-MIL-STD-750-Method1021
    ·Environmental-Engineering-Considerations-And-Laboratory-Tests-MIL-STD-810-Method507
    ·Microcircuits-MIL-STD-883-Method1004
    ·Generic-Reliability-Assurance-Requirements-for-Optoelectronic-Devices-Used-in-Telecommunications-Equipment-GR-468-CORE
    ·IEC-61000-4-x-Tests-for-TI’s-Protection-Devices-IEC61000-4-2
    ·Human-Body-Model(HBM)-vs.-IEC-61000-4-2
    ·Physical-Protection-GR-63-CORE
    ·Environmental-Testing-IEC 60068-2-78-2001
    ·Electronic-And-Electrical-Component-Parts-MIL-STD-202-Method108
    ·Test-Methods-For-Semiconductor-Devices-MIL-STD-750-Method1031
    ·Microcircuits-MIL-STD-883-Method1008
    ·Connectors-Electrical-Rectangular-Non-environmental-Miniature-Polarized-Shell-Rack-And-Panel-General-Specification-EIA-364-09
    ·Generic-Requirements-for-Electronic-Equipment-Cabinets-GR-487-CORE
    ·Test-Methods-For-Electrical-Connectors-MIL-STD-1344A
    ·Microcircuits-MIL-STD-883-Method2002
    ·Microcircuits-MIL-STD-883-Method2007
    ·Generic-Requirements-for-Singlemode-Optical-Connectors-and-Jumper-Assemblies-GR-326-CORE
    ·Test-Methods-For-Semiconductor-Devices-MIL-STD-750-Method1051
    ·Test-Methods-For-Semiconductor-Devices-MIL-STD-750-Method1055
    ·Microcircuits-MIL-STD-883-Method1007
    ·Microcircuits-MIL-STD-883-Method1010