Product
Application Notes
News
About

Hot Recommended

40G QSFP+ SR4 ,400m
10G SFP+ ER, 40km
1G SFP SX, 300m
10G SFP+ Copper, 80m
40G Active DAC, QSFP+
CodingBox

Die Bonder 2

Time: 2026-06-11

Die Bonder 2

PREVIOUS：Die Bonder

NEXT：Wire Bonder

Product
About

Application Notes
News

TEL: +852 6580 3163
ADD: Workshop 2, 4 Floor, Harry Industrial Building, Nos.49-51 Au Pui Wan Street, Shatin, NT, Hong Kong
E-mail: sales@moduletek.com

Reception Desk

Company Interior

Sales Office

R&D Office

Compatibility Testing Workshop

Manual Soldering Team

ICP No.16062245 ModuleTek Do Best Service Every Time.