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Teardown of Nokia 7250 IXR-e Switch
Time: 2024-03-05
Moduletek Laboratory recently purchased a Nokia 7250 IXR-e switch (24SFP+ 8SFP28 2QSFP28). We previously shared its unboxing in the article Nokia 7250 IXR-E Switch Unboxing. To further understand this device, we perform a basic teardown and analysis to showcase its internal structure.
Device specifications and panel interface details have been introduced earlier and will not be repeated here.
Figure 1 Nokia 7250 IXR-e Front Panel
After removing the top cover, the internal structure is divided into two main parts: a main PCB control board integrating various chips, resistors, and heat dissipation components; and a power board connected with two external DC power modules. Four cooling fans are independently mounted on one side.
The main PCB features one Altera 5M2210ZF324C4N (MAX V CPLD) chip of the same model on both its front and rear sides. Next to the power module is the memory bank, which contains 9 Samsung K4A4G08WF-BITD memory chips. A vertical metal baffle is installed between the memory chips and the CPLD. Beneath the largest heat sink are four parallel Samsung K4A4G165WE-BIRC memory chips, with a Marvell 88E1512-NNP2 Gigabit Ethernet transceiver adjacent to them.
Figure 2 Internal Structure of Nokia 7250 IXR-e
The rear side of the main PCB has a dense layout of solder points, reflecting a highly integrated circuit design.
Figure 3 Rear Side of Nokia 7250 IXR-e Main PCB
After removing the largest heat sink, the main switching chip is exposed: a Broadcom BCM88470CB0IFSBG. The other two black heat sinks are tightly bonded to the underlying chips, so we do not forcibly remove them during this teardown.
Figure 4 Main Switching Chip of Nokia 7250 IXR-e
After teardown, reassemble the switch and reboot it to check the system status. The normal startup of the sleek TIMOS operating system indicates the device is in good working condition.
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