ADVA FSP150CC-825 Switch Showcase

Moduletek Laboratory introduces the ADVA FSP150CC-825 switch in this document, covering three aspects: appearance, device management, and internal structure.

1. Product Introduction

The front panel of the ADVA FSP150CC-825 switch is equipped with 7×RJ45 ports, 3×SFP ports, 1×RJ45 serial port, 1×management port, and 2×power module slots. The rear panel features a DC power input port and cooling heat sinks, with air vents designed on both sides of the device. The official specifications and physical appearance of the switch are shown below.

Figure 1 Official Description

Figure 2 Front and Rear Panel Overview

2. Device Management

The ADVA FSP150CC-825 switch supports management via Command Line Interface (CLI) and Web Graphical User Interface (Web GUI). The CLI supports access through serial port, SSH, and Telnet.

Power-Up and Console Login

Connect the power cord to power on the device. Use an RJ45-to-DB9 serial cable to connect the PC to the switch’s serial port.

• Default baud rate: 9600

• Default login credentials: Username covaro1 / Password covaro#1

Figure 3 Device Power-Up

CLI Management

Connect a Moduletek SFP-GE-T module to the ADVA FSP150CC-825 switch using a patch cord. The module will establish a normal link, and the port indicator will light up. Execute the command below to view the interface status and module identification information:

show interface <port-number>

Web GUI Management

Connect your PC to the switch’s management port LAN with a network cable. The default management IP address is 192.168.0.2. Open a local browser, enter the IP address to access the Web management page, and the homepage will display device and system overview information.

Figure 4 Web GUI Homepage

Click the corresponding switch interface under the Configuration icon in the upper-left corner; the page will display the interface’s configuration, running status, and inserted module details.

Figure 5 Interface Status Information Page

3. Disassembly & Internal Structure

Remove the top cover of the switch, and its internal structure is divided into two main parts:

1. Main PCB motherboard: Integrates various main chips, resistors, cooling components, and DC power supply circuits.

2. AC power supply board: Adopts a fanless design for stable operation.

Figure 6 Internal Structure of FSP150CC-825

Two heat sinks are installed inside the device:

• One is a column-array heat sink, attached to the main chip and non-detachable.

• The other is a copper bar heat sink, under which is an XC4VLX80 chip — a Xilinx Virtex-4 series FPGA chip. This chip supports flexible logic configuration according to user needs, including digital signal processing, interface control, basic data forwarding, and simple VLAN partitioning.